Tens of software vulnerabilities affected Qualcomm firmware and impacted the devices of Microsoft, Lenovo, and Samsung.
Qualcomm January 2023 security bulletin addressed 22 software vulnerabilities in its Snapdragon suite. Some of the flaws were reported by the efiXplorer Team at the firmware protection firm Binarly, Zinuo Han of OPPO Amber Security Lab, Gengjia Chen from IceSword Lab, the researchers nicolas (nicolas1993), Seonung Jang of STEALIEN, and Le Wu of Baidu Security.
Below are reported the most severe vulnerabilities addressed by the company:
| Public ID | Security Rating | CVSS Rating | Technology Area | Date Reported |
|---|---|---|---|---|
| CVE-2022-33218 | Critical | High | Automotive | Internal |
| CVE-2022-33219 | Critical | Critical | Automotive | Internal |
| CVE-2022-33265 | Critical | High | Powerline Communication Firmware | Internal |
| CVE-2022-25725 | High | Medium | UTILS | Internal |
| CVE-2022-25746 | High | High | KERNEL | Internal |
| CVE-2022-33252 | High | High | WLAN Firmware | Internal |
| CVE-2022-33253 | High | High | WLAN Firmware | Internal |
| CVE-2022-33266 | High | Medium | Audio | Internal |
| CVE-2022-33274 | High | High | Android Core | Internal |
| CVE-2022-33276 | High | High | WLAN Firmware | Internal |
| CVE-2022-33283 | High | High | WLAN Firmware | Internal |
| CVE-2022-33284 | High | High | WLAN Firmware | Internal |
| CVE-2022-33285 | High | High | WLAN Firmware | Internal |
| CVE-2022-33286 | High | High | WLAN Firmware | Internal |
| CVE-2022-33290 | High | High | Automotive Connectivity | Internal |
| CVE-2022-33299 | High | High | Automotive Connectivity | Internal |
| CVE-2022-33300 | High | High | Automotive Android OS | Internal |
| CVE-2022-40516 | High | High | Boot | 10/28/2022 |
| CVE-2022-40517 | High | High | Boot | 10/28/2022 |
| CVE-2022-40520 | High | High | Connectivity | 10/28/2022 |
The most severe flaw is an integer overflow to buffer overflow in Automotive tracked as CVE-2022-33219 (CVSS Score 9.3).
“Memory corruption in Automotive due to integer overflow to buffer overflow while registering a new listener with shared buffer.” reads the advisory.
Other two severe issues fixed by Qualcomm are:
- CVE-2022-33218 (CVSS Score 8.2) – the flaw is a Memory corruption in Automotive due to improper input validation.
- CVE-2022-33265 (CVSS Score 7.3) – the flaw is an Information exposure in Powerline Communication Firmware.
The flaws impacted laptops and other devices using Snapdragon chipsets that are manufactured by Lenovo, Microsoft, and Samsung.
Lenovo released updates to address the vulnerabilities impacting the ThinkPad X13s BIOS.
Follow me on Twitter: @securityaffairs and Facebook and Mastodon
|
|
(SecurityAffairs – hacking, Moshen Dragon)
The post Qualcomm Snapdragon flaws impact Lenovo, Microsoft, Lenovo, and Samsung devices appeared first on Security Affairs.
