Categories
October Surprise 2024

CMP Slurry – HORIBA

A sub-standard slurry batch can contain particles that are too fine or too coarse, affecting the removal rate, or can contain a few oversized aggregates that cause micro scratches on the wafer surface. CMP slurry manufacturers and users are highly interested in particle size information. This measurement can prevent the loss of millions of dollars worth of wafers by distinguishing good slurry …